Low temperature curing epoxy adhesive's profile
Register date: November 13, 2022
United States
Huizhou City, Guangdong，China
15016086206
15016086206
https://www.deepmaterialcn.com/low-temperature-curing-epoxy-adhesive-for-sensitive-devices-and-circu
User Description
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.